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Actual multiple monitors crack5/25/2023 ![]() Specifically, the crack-onset strain of a high-mobility semiconducting polymer thin film improved from 30% to 110% strain without any noticeable microcracks. As a result, crack initiation and propagation are notably delayed to much higher strains. ![]() This enables high interfacial toughness between the layers, suppression of delamination and delocalization of strain. ![]() We present a universal design strategy that involves covalently bonding a dissipative interfacial polymer layer, consisting of dynamic non-covalent crosslinks, between a semiconducting thin film and a substrate. Here we show that engineering the interfacial properties between a semiconducting thin film and a substrate can notably delay microcrack formation in the film. Recently, the improved intrinsic mechanical properties of semiconducting polymer films have been reported through molecular design 15, 16, 17, 18 and nanoconfinement 19. However, high-mobility semiconducting polymers are usually brittle and can be easily fractured under small strains (<10%) 12, 13, 14. Semiconducting polymer thin films are essential elements of soft electronics for both wearable and biomedical applications 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11.
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